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hlmp-rd11/sd11/rg10/sg10/rl10/sl10 4 mm super oval precision optical performance alingap leds data sheet features ? f wellfdefnedfspatialfradiationfpattern ? f viewingfangle: f f f f f majorfaxisf120 f f f f minorfaxisf60 ? f highfluminousfoutput ? f twofredfandfamberfintensityflevels: f f f alingapf(bright)fandfalingapfiif(brightest) ? f colors: f f f f f 626/630fnmfred f f f f 590/592fnmfamber ? f superiorfresistanceftofmoisture ? f uvfresistantfepoxy applications ? f fullfcolorfsigns benefts ? f viewingf anglef designedf forf widef feldf off viewf applications ? f superiorfperformancefforfoutdoorfenvironments description thesefprecisionfopticalfperformancefovalfledsfarefspecif - callyfdesignedfforffullfcolor/videofandfpassengerfinforma - tionfsigns.fthefovalfshapedfradiationfpatternf(60fxf120)f andf highf luminousf intensityf ensuref thatf thesef devicesf aref excellentf forf widef feldf off viewf outdoorf applicationsf wheref af widef viewingf anglef andf readabilityf inf sunlightf aref essential.f thesef lampsf havef veryf smooth,f matchedf radiationfpatternsfensuringfconsistentfcolorfmixingfinffullf colorfapplications,fmessagefuniformityfacrossfthefviewingf anglefoffthefsign. highf efciencyf ledf materialsf aref usedf inf thesef lamps:f aluminumf indiumf galliumf phosphidef (alingap)f forf redf andfamberfcolor.ftherefareftwoffamiliesfoffredfandfamberf lamps,f alingapf andf thef higherf performancef alingapf ii.f eachflampfisfmadefwithfanfadvancedfopticalfgradefepoxyf oferingf superiorf highf temperaturef andf highf moisturef resistancef inf outdoorf applications.f thef packagef epoxyf containsf bothf uv-af andf uv-bf inhibitorsf tof reducef thef efectsfofflongftermfexposureftofdirectfsunlight. designersfcanfselectfparallelf(wherefthefaxisfoffthefleadsf isf parallelf tof thef widef axisf off thef ovalf radiationf pattern)f orfperpendicularforientation.fbothflampsfarefavailablefinf tintedfversion.
2 package dimensions 4.0 0.20 (0.157 0.008) 1.25 0.20 (0.049 0.008) 0.80 (0.016) max. epoxy meniscus 9.50 0.50 (0.374 0.007) 0.44 0.20 (0.017 0.008) cathode lead a ? 6.30 0.20 (0.248 0.008) 2.54 0.30 (0.100 0.012) 21.0 (0.827) min. 1.0 (0.039) min. 0.40 +0.10 ?0 (0.016 +0.004 ?0.000) 0.45 +0.10 ?0.04 (0.018 +0.004 ?0.002) 4.0 0.20 (0.157 0.008) 1.25 0.20 (0.049 0.008) 0.80 (0.016) max. epoxy meniscus 9.50 0.50 (0.374 0.007) 0.44 0.20 (0.017 0.008) cathode lead b ? 6.30 0.20 (0.248 0.008) 2.54 0.30 (0.100 0.012) 21.0 (0.827) min. 1.0 (0.039) min. 0.40 +0.10 ?0 (0.016 +0.004 ?0.000) 0.45 +0.10 ?0.04 (0.018 +0.004 ?0.002) dimensions are in millimeters (inches).
3 device selection guide for alingap ii color and dominant luminous intensity wavelength i v (mcd) at 20 ma leads with leadframe package part number d (nm) typ. min. max. stand-ofs orientation drawing hlmp-rd11-j0000 f redf630 f 240ffffffffffffff -f f yes f parallel f b hlmp-rd11-lp0xx f redf630 f 40f 1150f yes f parallel f b hlmp-rd11-lptxx f redf630 f 400 ffffffffffffff 1150f yes f parallel f b hlmp-sd11-j0000 f redf630 f 240ffffffffffffff -f yes f perpendicular f a hlmp-sd11-lp000 f redf630 f 400ffffffffffffff 1150f yes f perpendicular f a hlmp-sd11-lptxx f redf630 f 400ffffffffffffff 1150f yes f perpendicular f a hlmp-sd11-mn0xx f redf630 f 520ffffffffffffff 880f yes f perpendicular f a hlmp-sd11-mntxx f redf630 f 520ffffffffffffff 880f yes f perpendicular f a notes: 1.f thefluminousfintensityfisfmeasuredfonfthefmechanicalfaxisfofftheflampfpackage. 2.f thefopticalfaxisfisfcloselyfalignedfwithfthefpackagefmechanicalfaxis. 3.ff thefdominantfwavelength,f d ,fisfderivedffromfthefciefchromaticityfdiagramfandfrepresentsfthefcolorfofftheflamp. f device selection guide for alingap part number color and dominant wavelength d (nm) typ. luminous intensity iv (mcd) at 20 ma leads with stand-of leadframe orientation package drawing min. max. hlmp-sg10-jm0xx redf626 240 680 yes perpendicular a hlmp-rg10-jm000 redf626 240 680 yes parallel b hlmp-sl10-hl0dd amberf590 180 520 yes perpendicular a hlmp-sl10-lm0dd amberf590 400 680 yes perpendicular a hlmp-sl10-lmkdd amberf590 400 680 yes perpendicular a hlmp-sl10-lmldd amberf590 400 680 yes perpendicular a hlmp-sl10-lp0xx amberf590 400 1150 yes perpendicular a hlmp-sl10-lpkdd amberf590 400 1150 yes perpendicular a hlmp-sl10-mnkxx amberf590 520 880 yes perpendicular a hlmp-sl10-mp0dd amberf590 520 1150 yes perpendicular a hlmp-sl10-mq0dd amberf590 520 1500 yes perpendicular a hlmp-sl10-mqldd amberf590 520 1500 yes perpendicular a hlmp-rl10-lmldd amberf590 400 680 yes parallel b hlmp-rl10-lp0xx amberf590 400 1150 yes parallel b hlmp-rl10-mp0dd amberf590 520 1150 yes parallel b hlmp-rl10-mqldd amberf590 520 1500 yes parallel b notes: 1.f thefluminousfintensityfisfmeasuredfonfthefmechanicalfaxisfofftheflampfpackage. 2.f thefopticalfaxisfisfcloselyfalignedfwithfthefpackagefmechanicalfaxis. 3.ff thefdominantfwavelength,f d ,fisfderivedffromfthefciefchromaticityfdiagramfandfrepresentsfthefcolorfofftheflamp.
4 absolute maximum ratings t a f=f25c parameter amber and red dcfforwardfcurrent 1 fffff 50fma peakfpulsedfforwardfcurrentf f 100fma averagefforwardfcurrentff f 30fma reversefvoltagef(i r f=f100f a) f 5fv powerfdissipation f 120fmw ledfjunctionftemperature f 130c operatingftemperaturefrange f C40cftof+100c storageftemperaturefrange f C40cftof+100c note: 1.ff derateflinearlyfasfshownfinffiguresf4. part numbering system mechanical options 00:fbulkfpackaging dd:fammofpack yy:fflexi-bin;fbulkfpackaging zz:fflexi-bin;fammofpack color bin & v f selections 0:fnofcolorfbinflimitation f t:fredfcolorfwithfv f fmaximumfoff2.6fv k:famberfcolorfbinsf2fandf4 l:famberfcolorfbinsf4fandf6 maximum intensity bin 0:fnofivfbinflimitation minimum intensity bin refer to device selection guide color d:f630fnmfred g:f626fnmfred l:f590fnmfamber package r:f4fmmf60fxf120oval,fparallel s:f4fmmf60fxf120oval,fperpendicular hlmpf -f xf xf xxf -f xf xf xf xx
5 electrical/optical characteristics t a f=f25c parameter symbol min. typ. max. units test conditions typicalfviewingfangle [1] f 2 ? f f f f deg f f f f f ffmajor f ff 120 f f f f f f f ffminor f f f 60 forwardfvoltage f v f ffff v f i f f=f20fma f ffredf( d f=f626fnm)f f f 1.9f 2.4 f f f ffredf( d f=f630fnm)f f f 2.0f 2.4 [2] f f ffamberf( d f=f590fnm)f f f 2.02f 2.4 reversefvoltage f v r ffff v f i r f=f100f a f f f ffamberfandfred f f 5f 20 f f f f f peakfwavelength f peak f f f f nmf peakfoffwavelengthfof f ffredf( d f=f626fnm)f f f 635 f f f spectralfdistribution f ffredf( d f=f630fnm)f f f 639 f f f atfi f f=f20fma f ffamberf( d f=f590fnm)f f f 592 f f f f f f spectralfhalfwidth f ? ? f f f f nmf wavelengthfwidthfat f ffredf( d f=f626/630fnm)f f f 17 f f f spectralfdistributionf f ffamberf( d f=f590fnm)f f f 17 f f f ?fpowerfpointfatfi f f=f20fma capacitance f cf f f f pff v f f=f0,fff=f1fmhz f f ffallfcolors f f f 40 thermalfresistance f r j-pin f f f f c/w f ledfjunction-to-cathode f ffallfcolors f f f 240 f f f lead luminousfefcacy [3]f vf f f f lm/wf emittedfluminousfpower/ f ffredf( d f=f626fnm)f f f 150 f f f emittedfradiantfpower f ffredf( d f=f630fnm)f f f 155 f f f f ffamberf( d f=f590fnm)f f f 480 f f f f f f notes: 1.fff 2 ? fisfthefof-axisfanglefwherefthefluminousfintensityfisfthefon-axisfintensity. 2.fff forfoptionsf-xxrxx,f-xxtxx,fandf-xxvxx,fmaximumfforwardfvoltage,fv f ,fisf2.6fv.fpleasefreferftofv f fbinftablefbelow. f ff 3.ff thefradiantfintensity,fi e ,finfwattsfperfsteradian,fmayfbeffoundffromfthefequationfi e f=fi v / v ,fwherefi v fisfthefluminousfintensityfinfcandelasfandf v fisf thefluminousfefcacyfinflumens/watt.
6 figure 4. amber, red maximum forward current vs. ambient temperature. figure 1. relative intensity vs. wavelength. figure 2. amber, red forward current vs. forward voltage. figure 3. amber, red relative luminous intensity vs. forward current. 0 40 20 i f ? forw ard current ? ma v f ? forw ard vol t a ge ? v 1.0 3.0 amber 1.5 2.0 2.5 10 30 50 red rela tive l uminous intensit y (normalized a t 20 ma) 0 0 i f ? forw ard current ? ma 20 40 2.0 1.0 50 0.5 1.5 2.5 30 10 i f ? forw ard current ? ma 0 0 t a ? ambient tempera ture ? c 40 80 50 40 30 20 10 20 60 100 r j-a = 585 c/ w 60 r j-a = 780 c/ w 120 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 500 550 600 650 700 wavelength - nm relative intensity red amber figure 5b. representative spatial radiation pattern for minor axis. figure 5a. representative spatial radiation pattern for major axis. rela tive intensi ty 1.0 0 angular displa cement ? degrees 0.8 0.6 0.2 -90 0.4 -60 0 -30 15 45 90 -45 -15 30 60 -75 75 rela tive intensi ty 1.0 0 angular displa cement ? degrees 0.8 0.6 0.2 -90 0.4 -60 0 -30 15 45 90 -45 -15 30 60 -75 75
7 intensity bin limits (mcdfatf20fma) bin name min. max. hf 180f 240 jf 240f 310 kf 310f 400 lf 400f 520 mf 520f 680 nf 680f 880 pf 880f 1150 tolerancefforfeachfbinflimitfisff15%. vf bin table 2 bin name min. max. f va f 2.0f 2.2 f vbf 2.2f 2.4 f vcf 2.4f 2.6 tolerancefforfeachfbinfisf0.05fv. note: 1.ff binfcategoriesfarefestablishedfforfclassifcationfoffproducts.fproductsf mayfnotfbefavailablefinfallfbinfcategories. 2.f vffbinningfisfapplicablefforfpartfnumbersfwithfoptionf-xxtxx. note: 1.f allf binf categoriesf aref establishedf forf classifcationf off products.f productsf mayf notf bef availablef inf allf binf categories.f pleasef contactf yourfavagofrepresenta f tivesfforffurtherfinformation. color bin limits (nmfatf20fma) amber colour range (nm) bin id min. max. f 1f 584.5f 587.0 f 2f 587.0f 589.5 f 4f 589.5f 592.0 f 6f 592.0f 594.5 tolerancefforfeachfbinflimitfisf0.5fnm.
8 precautions: lead forming: ? f thefleadsfoffanfledflampfmayfbefpreformedforfcutftof lengthfpriorftofinsertionfandfsolderingfonfpcfboard. ? f forf betterf control,f itf isf recommendedf tof usef properf toolftofpreciselyfformfandfcutfthefleadsftofapplicablef lengthfratherfthanfdoingfitfmanually. ? f iffmanualfleadfcuttingfisfnecessary,fcutfthefleadsfafterf thef solderingf process.fthef solderf connectionf formsf af mechanicalfgroundfwhichfpreventsfmechanicalfstressf duef tof leadf cuttingf fromf travelingf intof ledf package.f thisfisfhighlyfrecommendedfforfhandfsolderfoperation,f asfthefexcessfleadflengthfalsofactsfasfsmallfheatfsink. soldering and handling: ? f carefmustfbeftakenfduringfpcbfassemblyfandfsolderingf processftofpreventfdamageftofthefledfcomponent.f ? f ledf componentf mayf bef efectivelyf handf solderedf tof pcb.f however,f itf isf onlyf recommendedf underf unavoidablefcircumstancesfsuchfasfrework.fthefclosestf manualfsolderingfdistancefoffthefsolderingfheatfsourcef (solderingfironsftip)ftofthefbodyfisf1.59mm.fsolderingf thef ledf usingf solderingf ironf tipf closerf thanf 1.59mmf mightfdamagefthefled. note:f 1.f pcbf withf diferentf sizef andf designf (componentf density)f willf havef diferentf heatf massf (heatf capacity).f thisf mightf causef af changef inf temperaturef experiencedf byf thef boardf iff samef wavef solderingf settingfisfused.fso,fitfisfrecommendedftofre-calibratefthefsolderingf proflefagainfbeforefloadingfafnewftypefoffpcb. 2.f avagoftechnologiesf highf brightnessf ledf aref usingf highf efciencyf ledfdiefwithfsinglefwirefbondfasfshownfbelow.fcustomerfisfadvisedf tof takef extraf precautionf duringf wavef solderingf tof ensuref thatf thef maximumfwaveftemperaturefdoesfnotfexceedf250cfandfthefsolderf contactftimefdoesfnotfexceedingf3sec.fover-stressingfthefledfduringf solderingfprocessfmightfcausefprematureffailureftofthefledfdueftof delamination. avago technologies led confguration 1.59mm ? f esdf precautionf mustf bef properlyf appliedf onf thef solderingf stationf andf personnelf tof preventf esdf damagef tof thef ledf componentf thatf isf esdf sensitive.f dofreferftofavagofapplicationfnotefanf1142fforfdetails.f thef solderingf ironf usedf shouldf havef groundedf tipf tof ensurefelectrostaticfchargefisfproperlyfgrounded. ? f recommendedfsolderingfcondition: wave soldering [1, 2] manual solder dipping pre-heatftemperature 105fcfmax. - preheatftime 60fsecfmax - peakftemperature 250fcfmax. 260fcfmax. dwellftime 3fsecfmax. 5fsecfmax note:f 1)f abovef conditionsf refersf tof measurementf withf thermocouplef mountedfatfthefbottomfoffpcb. 2)f itfisfrecommendedftofusefonlyfbottomfpreheatersfinforderftofreducef thermalfstressfexperiencedfbyfled. ? f wavefsolderingfparametersfmustfbefsetfandfmaintainedf accordingftofthefrecommendedftemperaturefandfdwellf time.fcustomerfisfadvisedftofperformfdailyfcheckfonfthef solderingfprofleftofensurefthatfitfisfalwaysfconformingf tofrecommendedfsolderingfconditions. f note:felectricalfconnectionfbetweenfbottomfsurfacefoffledfdiefandf thefleadfframefisfachievedfthroughfconductivefpaste. ? f anyf alignmentf fxturef thatf isf beingf appliedf duringf wavef solderingf shouldf bef looselyf fttedf andf shouldf notfapplyfweightforfforcefonfled.fnonfmetalfmaterialf isfrecommendedfasfitfwillfabsorbflessfheatfduringfwavef solderingfprocess. ? f atf elevatedf temperature,f ledf isf moref susceptiblef tof mechanicalfstress.ftherefore,fpcbfmustfallowedftofcoolf downf tof roomf temperaturef priorf tof handling,f whichf includesfremovalfoffalignmentffxtureforfpallet. ? f iffpcbfboardfcontainsfbothfthroughfholef(th)fledfandf otherfsurfacefmountfcomponents,fitfisfrecommendedf thatf surfacef mountf componentsf bef solderedf onf thef topfsidefoffthefpcb.fiffsurfacefmountfneedftofbefonfthef bottomf side,f thesef componentsf shouldf bef solderedf usingfrefowfsolderingfpriorftofinsertionfthefthfled. ? f recommendedf pcf boardf platedf throughf holesf (pth)f sizefforfledfcomponentfleads. led component lead size diagonal plated through hole diameter 0.45fxf0.45fmm (0.018xf0.018finch) 0.636fmm (0.025finch) 0.98ftof1.08fmm (0.039ftof0.043finch) 0.50fxf0.50fmm (0.020xf0.020finch) 0.707fmm (0.028finch) 1.05ftof1.15fmm (0.041ftof0.045finch) ? f over-sizingf thef pthf canf leadf tof twistedf ledf afterf clinching.fonfthefotherfhandfunderfsizingfthefpthfcanf causefdifcultyfinsertingfthefthfled. allngap device cathode
9 example of wave soldering temperature profle for th led 0 10 20 30 40 50 60 70 80 90 100 250 200 150 100 50 time (minutes) preheat turbulent wave laminar wave hot air knife recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin flux solder bath temperature: 245c 5c (maximum peak temperature = 250c) dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) note: allow for board to be sufficiently cooled to room temperature before exerting mechanical force. referftofapplicationfnotefan5334fforfmorefinformationfaboutfsolderingfandfhandlingfoffhighfbrightnessfthfledflamps. note:fthefammo-packsfdrawingfisfapplicablefforfpackagingfoptionfCddf&f-zzfandfregardlessfstandofforfnon-standof ammo packs drawing 6.351.30 0.250.0512 9.1250.625 0.35930.025 18.000.50 0.70870.0197 12.700.30 0.500.0118 20.51.00 0.80710.0394 12.701.00 0.500.0394 cathode view a - a 0.700.20 0.2760.0079 4.000.20 0.15750.0079 ? typ.
10 packaging label (i)f avagofmotherflabel:f(availablefonfpackagingfboxfoffammofpackfandfshippingfbox) ( 1 p ) i t e m : p a r t n u m b e r (1t) lot: lot number lpn: (9d)mfg date: manufacturing date ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: refer to below information (9d) date code: date code s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c (1p) part # : part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: refer to below information datecode: date code r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y label note:fforfinganfdevice,fthefammofpackfpackagingfboxfcontainfesdflogo packaging box for ammo packs
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2009 avago technologies. all rights reserved. obsoletes 5989-4174en av02-1544en - february 20, 2009 acronyms and defnition: bin:f (i)f colorfbinfonlyforfvffbinfonly f (applicablefforfpartfnumberfwithfcolorfbinsfbutfwithoutf vffbinforfpartfnumberfwithfvffbinsfandfnofcolorfbin) orfffffffff (ii)f colorfbinfincorporatedfwithfvffbin f (applicablef forf partf numberf thatf havef bothf colorf binf andfvffbin) (ii)f avagofbabyflabelf(onlyfavailablefonfbulkfpackaging) example: (i)f colorfbinfonlyforfvffbinfonly f bin:f2f(representfcolorfbinf2fonly) f bin:fvbf(representfvffbinfvbfonly) (ii)f colorfbinfincorporatefwithfvffbin f bin:f2vbff f f vb:fvffbinfvb f f 2:ffcolorfbinf2fonly disclaimer avagosfproductsfandfsoftwarefarefnotfspecificallyfdesigned,fmanufacturedforfauthorizedfforf salefasfparts,fcomponentsforfassembliesfforfthefplanning,fconstruction,fmaintenanceforfdirectf operationfoffafnuclearffacilityforfforfusefinfmedicalfdevicesforfapplications.ffcustomerfisfsolelyf responsible,f andfwaivesf allf rightsftof makef claimsf againstf avagof orf itsf suppliers,f forf allf loss,f damage,fexpenseforfliabilityfinfconnectionfwithfsuchfuse. ( 1 p ) i t e m : p a r t n u m b e r (1t) lot: lot number lpn: (9d)mfg date: manufacturing date ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: refer to below information (9d) date code: date code s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c (1p) part # : part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: refer to below information datecode: date code r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y label

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